NEWS
Monolithic 3D: Promise, Challenges
Researchers said monolithic 3D chip stacks have promise but face several challenges at an event attended by CEA-Leti, Qualcomm, ARM and others
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DRAM Capacity Crunch Expected to Persist in 2018
With suppliers planning only limited capacity and demand on the rise, DRAMeXchange says price declines unlikely
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Apple Watch Packs Qualcomm LTE
Qualcomm supplied the LTE modem in the Apple Watch Series 3 as well as a handful of other wireless chips, acco
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Win some, lose some: DRAM stands on shaky ground
DRAM has found itself in the situation of being a low-margin, commodity memory in a slowing tablet and PC market, while it still makes the most sense from a performance, density and cost perspective
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Weltrend snags design win for heart rate monitoring
The reference design combines Weltrend Semiconductor s WTHRM122 HRM MCU with New Japan Radio s optical sensor and ROHM s KXTJ2-1009 accelerometer
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Universal generic platform speeds up FPGA prototyping
The Generic Tanto 3 allows user modification for rapid prototyping, integration of interfaces and for complex, yet efficient chip designs
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Slim Flash process cuts down embedded layers by 20%
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage
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Samsung's plans to ship 10nm SoCs in full sail
The 10LPE process uses triple-patterning lithography to deliver up to a 30% area shrink, 27% higher performance or 40% lower power than 14nm process
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