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Weltrend snags design win for heart rate monitoring

The reference design combines Weltrend Semiconductor s WTHRM122 HRM MCU with New Japan Radio s optical sensor and ROHM s KXTJ2-1009 accelerometer

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Universal generic platform speeds up FPGA prototyping

The Generic Tanto 3 allows user modification for rapid prototyping, integration of interfaces and for complex, yet efficient chip designs

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Slim Flash process cuts down embedded layers by 20%

MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage

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Samsung's plans to ship 10nm SoCs in full sail

The 10LPE process uses triple-patterning lithography to deliver up to a 30% area shrink, 27% higher performance or 40% lower power than 14nm process

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Why foundries need clear, public benchmarks

​Over the last few years, the industry has embraced the idea of measuring a process node by PPA—performance, power and area

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TSMC advances push into 3nm, machine learning

The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC

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Samsung Says EUV on Schedule for 2018

Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings

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NOR Flash Standard Meets Instant-On Expectations

IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash

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