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Why foundries need clear, public benchmarks

​Over the last few years, the industry has embraced the idea of measuring a process node by PPA—performance, power and area

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TSMC advances push into 3nm, machine learning

The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC

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Samsung Says EUV on Schedule for 2018

Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings

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NOR Flash Standard Meets Instant-On Expectations

IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash

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FinFETs compete with FD-SOI

Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers

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EUV rolls into TSMC's 7+nm node in 2018

TSMC has used an unnamed novel resist chemical to replace five immersion masks with one EUV mask at pitches ran

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Limitations of 3D NAND Scaling

The life span of 3D NAND might be a lot shorter than most people think At the Flash Memory Summit this year,

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DRAM-less SSD controller delivers up to 1600MB/s read speeds

The 88NV1160 can be used in a single ball grid array package SSD, as well as in a standalone controller in a

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