CASE STUDIES
NXP to Bridge MCU & AP with 'Crossovers'
To use an MCU or not (and to opt for an apps processor instead)? This is an eternal question for embedded system designers, and one that NXP Semiconductors hopes to answer by launching a new high-end MCU
Show Detail >>
Monolithic 3D: Promise, Challenges
Researchers said monolithic 3D chip stacks have promise but face several challenges at an event attended by CEA-Leti, Qualcomm, ARM and others
Show Detail >>
DRAM Capacity Crunch Expected to Persist in 2018
With suppliers planning only limited capacity and demand on the rise, DRAMeXchange says price declines unlikely
Show Detail >>
Apple Watch Packs Qualcomm LTE
Qualcomm supplied the LTE modem in the Apple Watch Series 3 as well as a handful of other wireless chips, acco
Show Detail >>
Win some, lose some: DRAM stands on shaky ground
DRAM has found itself in the situation of being a low-margin, commodity memory in a slowing tablet and PC market, while it still makes the most sense from a performance, density and cost perspective
Show Detail >>
Weltrend snags design win for heart rate monitoring
The reference design combines Weltrend Semiconductor s WTHRM122 HRM MCU with New Japan Radio s optical sensor and ROHM s KXTJ2-1009 accelerometer
Show Detail >>
Universal generic platform speeds up FPGA prototyping
The Generic Tanto 3 allows user modification for rapid prototyping, integration of interfaces and for complex, yet efficient chip designs
Show Detail >>
Slim Flash process cuts down embedded layers by 20%
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage
Show Detail >>CONTACT US
Zarchin 10St.Raanana,43662 Israel
238884 Singapore