CASE STUDIES
Samsung Says EUV on Schedule for 2018
Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings
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NOR Flash Standard Meets Instant-On Expectations
IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash
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FinFETs compete with FD-SOI
Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers
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EUV rolls into TSMC's 7+nm node in 2018
TSMC has used an unnamed novel resist chemical to replace five immersion masks with one EUV mask at pitches ran
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Limitations of 3D NAND Scaling
The life span of 3D NAND might be a lot shorter than most people think At the Flash Memory Summit this year,
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DRAM-less SSD controller delivers up to 1600MB/s read speeds
The 88NV1160 can be used in a single ball grid array package SSD, as well as in a standalone controller in a
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Controller supports SD 6.0 spec
Silicon Motion Technology has introduced what it claims is the first merchant SD memory controller to support SD
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Western Digital Still Hopes to Block Toshiba Chip Sale
Western Digital still believes it can block the sale of Toshiba s chip unit to a consortium led by Bain Capital through arbitration tribunals at the International Chamber of Commerce
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